JPH0451503Y2 - - Google Patents

Info

Publication number
JPH0451503Y2
JPH0451503Y2 JP1984047506U JP4750684U JPH0451503Y2 JP H0451503 Y2 JPH0451503 Y2 JP H0451503Y2 JP 1984047506 U JP1984047506 U JP 1984047506U JP 4750684 U JP4750684 U JP 4750684U JP H0451503 Y2 JPH0451503 Y2 JP H0451503Y2
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
metal plate
adhesive layer
plating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984047506U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60160564U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4750684U priority Critical patent/JPS60160564U/ja
Publication of JPS60160564U publication Critical patent/JPS60160564U/ja
Application granted granted Critical
Publication of JPH0451503Y2 publication Critical patent/JPH0451503Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP4750684U 1984-03-31 1984-03-31 プラグインパツケ−ジ基板 Granted JPS60160564U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4750684U JPS60160564U (ja) 1984-03-31 1984-03-31 プラグインパツケ−ジ基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4750684U JPS60160564U (ja) 1984-03-31 1984-03-31 プラグインパツケ−ジ基板

Publications (2)

Publication Number Publication Date
JPS60160564U JPS60160564U (ja) 1985-10-25
JPH0451503Y2 true JPH0451503Y2 (en]) 1992-12-03

Family

ID=30562898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4750684U Granted JPS60160564U (ja) 1984-03-31 1984-03-31 プラグインパツケ−ジ基板

Country Status (1)

Country Link
JP (1) JPS60160564U (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2813682B2 (ja) * 1989-11-09 1998-10-22 イビデン株式会社 電子部品搭載用基板
JP2016197691A (ja) * 2015-04-06 2016-11-24 オムロンオートモーティブエレクトロニクス株式会社 プリント基板、電子装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5932191A (ja) * 1982-08-18 1984-02-21 イビデン株式会社 プリント配線基板とその製造方法

Also Published As

Publication number Publication date
JPS60160564U (ja) 1985-10-25

Similar Documents

Publication Publication Date Title
JPH0378795B2 (en])
JPH0258358A (ja) 電子部品搭載用基板
JPH04125953A (ja) 電子部品搭載用基板及びその製造法
JPH0451503Y2 (en])
JPH0420279B2 (en])
JP3018789B2 (ja) 半導体装置
JPH0878795A (ja) チップ状部品搭載用プリント基板およびその製造方法
JPH0446478B2 (en])
JPH04142068A (ja) 電子部品搭載用基板及びその製造方法
JPS61172393A (ja) 電子部品搭載用基板およびその製造方法
JPS6134989A (ja) 電子部品搭載用基板
JP2809316B2 (ja) 電子部品搭載用基板
JPH0358552B2 (en])
JPH056714Y2 (en])
JP2004140160A (ja) 配線板の製造方法及び配線板、ならびに半導体装置
JPS60111489A (ja) 電子部品塔載用基板およびその製造方法
JPS6252991A (ja) 電子素子用チツプキヤリア
JPH0225242Y2 (en])
JPH0685464B2 (ja) 電子部品搭載用基板の製造方法
JPH0311787A (ja) 電子部品搭載用基板
JPH02262355A (ja) 放熱板
JP2834821B2 (ja) 電子部品搭載用基板
JPS59217385A (ja) プリント配線基板
JPH0543488Y2 (en])
JPS62263685A (ja) プリント配線基板